首页> 外国专利> MANUFACTURING METHOD FOR ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MASK BLANK COMPRISING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PHOTO MASK, FORMING METHOD FOR PATTERN, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

MANUFACTURING METHOD FOR ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MASK BLANK COMPRISING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PHOTO MASK, FORMING METHOD FOR PATTERN, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

机译:感光性或辐射敏感性树脂组合物的制造方法,感光性或辐射敏感性树脂组合物,感光性或辐射敏感性的膜状物,空白,感光性或辐射状的膏状坯料的制造方法,图案的形成方法,电子设备的制造方法以及电子设备

摘要

A manufacturing method for an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin, an acid generator, an organic acid, and a solvent, includes at least one of (i), (ii), or (iii) below, and a content ratio of the organic acid in the actinic ray-sensitive or radiation-sensitive resin composition is greater than 5% by mass based on a total solid content in the composition; (i) dissolving the organic acid in a solution that does not substantially contain the resin and the acid generator, (ii) dissolving the organic acid in a solution that contains the acid generator and does not substantially contain the resin, and (iii) dissolving the organic acid in a solution that contains the resin and does not substantially contain the acid generator, an actinic ray-sensitive or radiation-sensitive resin composition, an actinic ray-sensitive or radiation-sensitive film, a mask blank including the film, a forming method for a photo mask and a pattern, a manufacturing method for an electronic device, and an electronic device.
机译:包含树脂,产酸剂,有机酸和溶剂的光化射线敏感或辐射敏感树脂组合物的制造方法包括以下(i),(ii)或(iii)中的至少一种并且,光化射线敏感性或放射线敏感性树脂组合物中的有机酸的含有比例相对于组合物中的全部固体成分为大于5质量%。 (i)将有机酸溶解在基本上不含树脂和酸产生剂的溶液中,(ii)将有机酸溶解在含有酸产生剂但基本上不含树脂的溶液中,和(iii)溶解含有树脂且基本上不含酸产生剂的溶液中的有机酸,光化射线敏感或辐射敏感的树脂组合物,光化射线敏感或辐射敏感的膜,包括该膜的掩模坯,用于光掩模和图案的形成方法,用于电子装置的制造方法以及电子装置。

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