首页> 外国专利> Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides

Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides

机译:具有垂直排列的光栅耦合器的多芯片模块,用于在光波导之间传输光信号

摘要

Disclosed are multi-chip modules (MCMs) that allow for chip-to-chip transmission of light signals. The MCMs can incorporate at least two components, which are attached (e.g., by interconnects). For example, in one MCM disclosed herein, the two components can be an integrated circuit chip and an interposer to which the integrated circuit chip and one or more additional integrated circuit chips are attached by interconnects. In another MCM disclosed herein, the two components can be two integrated circuit chips that are stacked and attached to each other by interconnects. In either case, the two components can each have a waveguide and a grating coupler coupled to one end of the waveguide. The grating couplers on the different components can be approximately vertically aligned, thereby allowing light signals to be transmitted between the waveguides on those different components. Also, disclosed herein are methods of forming such MCMs.
机译:公开了允许光信号的芯片到芯片传输的多芯片模块(MCM)。 MCM可以包含至少两个相连的组件(例如,通过互连)。例如,在本文公开的一个MCM中,两个组件可以是集成电路芯片和插入件,该集成电路芯片和一个或多个附加的集成电路芯片通过互连件附接到该插入件。在本文公开的另一MCM中,两个组件可以是堆叠并且通过互连彼此附接的两个集成电路芯片。在任何一种情况下,两个部件可各自具有波导和耦合到波导一端的光栅耦合器。不同组件上的光栅耦合器可以近似垂直对齐,从而允许在这些不同组件上的波导之间传输光信号。另外,本文公开了形成这种MCM的方法。

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