首页>
外国专利>
Through-silicon via (TSV)-based devices and associated techniques and configurations
Through-silicon via (TSV)-based devices and associated techniques and configurations
展开▼
机译:基于硅通孔(TSV)的设备以及相关技术和配置
展开▼
页面导航
摘要
著录项
相似文献
摘要
Embodiments of the present disclosure are directed toward through-silicon via (TSV)-based devices and associated techniques and configurations. In one embodiment, an apparatus includes a die having active circuitry disposed on a first side of the die and a second side disposed opposite to the first side, a bulk semiconductor material disposed between the first side and the second side of the die and a device including one or more of a capacitor, resistor or resonator disposed in the bulk semiconductor material, the capacitor, resistor or resonator including one or more TSV structures that extend through the bulk semiconductor material, an electrically insulative material disposed in the one or more TSV structures and an electrode material or resistor material in contact with the electrically insulative material within the one or more TSV structures.
展开▼