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Making Z-fold micro-wire substrate structure

机译:制作Z折微线基板结构

摘要

A method of making a folded micro-wire substrate structure includes providing a flexible substrate and first, second, and third portions. One or more electrical conductors are formed on or in the flexible substrate. The flexible substrate is folded with a first fold between the first and second portions so that the first portion is located adjacent to the second portion in a perpendicular direction. The flexible substrate is folded with at least a second fold between the second and third portions so that the second side is between the second portion and the third portion in the perpendicular direction. The folded flexible substrate is secured to form the folded micro-wire substrate structure.
机译:一种制造折叠的微线基板结构的方法,包括提供柔性基板以及第一,第二和第三部分。在柔性基板上或其内部形成一个或多个电导体。柔性基板在第一部分和第二部分之间以第一折痕折叠,使得第一部分在垂直方向上与第二部分相邻。柔性基板在第二部分和第三部分之间被至少第二折痕折叠,使得第二侧面在垂直方向上位于第二部分和第三部分之间。折叠的柔性基板被固定以形成折叠的微线基板结构。

著录项

  • 公开/公告号US9603240B2

    专利类型

  • 公开/公告日2017-03-21

    原文格式PDF

  • 申请/专利权人 EASTMAN KODAK COMPANY;

    申请/专利号US201414289896

  • 发明设计人 RONALD STEVEN COK;THOMAS NATHANIEL TOMBS;

    申请日2014-05-29

  • 分类号H05K1/18;H05K1/02;H05K3/22;H05K3/10;H05K3/12;H05K3/46;G06F3/044;

  • 国家 US

  • 入库时间 2022-08-21 13:43:05

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