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Parasitic plasma prevention in plasma processing chambers
Parasitic plasma prevention in plasma processing chambers
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机译:等离子处理室中的寄生等离子体预防
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摘要
Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.
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