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PARASITIC PLASMA PREVENTION IN PLASMA PROCESSING CHAMBERS
PARASITIC PLASMA PREVENTION IN PLASMA PROCESSING CHAMBERS
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机译:等离子体处理容器中的寄生等离子体预防
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摘要
The parasitic plasma in the void spaces in the parts of the plasma processing chamber can be removed by covering the electrically conductive surface inside the void spaces with the sleeve. The void spaces may be gas holes, lift pin holes, helium passages, conduits, and / or plenums in chamber components such as the top electrode and substrate support.
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