首页> 外国专利> Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress

Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress

机译:在带子上使用已打印RFID芯片的反应耦合,以使已打印材料被覆盖有一层隔离膜,以防止氧气和湿气进入

摘要

An RFID device using a printed electronic circuit (PEC) is disclosed. The PEC or electronic circuit which includes printed elements is coupled to a conductor structure, such as an antenna, by reactive means, such as an electric field, a magnetic field, or a combination of both. The RFID device comprises a base layer and a conductive layer (antenna structure) disposed over the base layer. A dielectric layer is then disposed over at least a portion of the conductive layer. A barrier layer is then disposed over the dielectric layer and fully covers the PEC to protect against oxygen and moisture ingress. Further, the PEC is typically attached to a carrier or strap to facilitate coupling between the antenna structure and PEC. In another embodiment, the barrier layer can be replaced with an adhesive layer that acts as both the barrier layer and the dielectric layer.
机译:公开了一种使用印刷电子电路(PEC)的RFID设备。包括印刷元件的PEC或电子电路通过诸如电场,磁场或两者的组合之类的无功装置耦合至诸如天线的导体结构。 RFID设备包括基层和设置在基层之上的导电层(天线结构)。然后将介电层设置在导电层的至少一部分上。然后,将阻挡层设置在介电层上并完全覆盖PEC,以防止氧气和湿气进入。此外,PEC通常附接到载体或带子以促进天线结构与PEC之间的耦合。在另一个实施例中,阻挡层可以被同时用作阻挡层和介电层的粘合剂层代替。

著录项

  • 公开/公告号US9697455B2

    专利类型

  • 公开/公告日2017-07-04

    原文格式PDF

  • 申请/专利权人 AVERY DENNISON RETAIL INFORMATION SERVICES LLC;

    申请/专利号US201414583255

  • 发明设计人 IAN JAMES FORSTER;

    申请日2014-12-26

  • 分类号G06K19/06;G06K19/077;

  • 国家 US

  • 入库时间 2022-08-21 13:42:11

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