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Materials integration for printed zinc oxide thin-film transistors: Engineering of a fully-printed semiconductor/contact scheme

机译：印刷氧化锌薄膜晶体管的材料集成：全印刷半导体/接触方案的工程

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Liu X.; Wegener M.; Polster S.; Jank M.P.M.; Roosen A.; Frey L.;
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年度 2016
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1. Materials Integration for Printed Zinc Oxide Thin-Film Transistors: Engineering of a Fully-Printed Semiconductor/Contact Scheme [J] . Liu Xinxin, Wegener Moritz, Polster Sebastian, Display Technology, Journal of . 2016,第3期

机译：印刷氧化锌薄膜晶体管的材料集成：全印刷半导体/接触方案的工程设计
2. Engineering of Flexo- and Gravure-Printed Indium–Zinc-Oxide Semiconductor Layers for High-Performance Thin-Film Transistors [J] . Spiehl Dieter, Haming Marc, Sauer Hans Martin, Electron Devices, IEEE Transactions on . 2015,第9期

机译：柔性薄膜印刷和凹版印刷铟锌氧化物半导体层的高性能薄膜晶体管工程
3. Manufacturing and Encapsulation Process of Bottom Gate Bottom Contact Thin-Film Transistors with a Printed Oxide Semiconductor [J] . Nesrine Kammoun, Yvonne Krieg, Guy Williams Ngaleu, SID International Symposium: Digest of Technology Papers . 2018,第2期

机译：具有印刷氧化物半导体的底部栅极底部触点薄膜晶体管的制造和封装过程
4. Solution-processed Oxide Thin-Film Transistor with Spin-coated Zinc Tin Oxide Active Layer and Indium Zinc Oxide Source/Drain Electrodes [C] . Yong-Jin Kim, Jeong-Soo Lee, Yong-Uk Lee, Thin film transistors 10(TFT 10) . 2010

机译：具有旋涂锌氧化锡有源层和氧化铟锌源/漏电极的固溶处理氧化物薄膜晶体管
5. Scalable, Gravure-printed Transparent Electronics: Materials and Process Design for Metal Oxide Thin-film Transistors [D] . Scheideler, William Joseph. 2017

机译：可扩展，凹版印刷透明电子产品：金属氧化物薄膜晶体管的材料和工艺设计
6. High-Mobility Inkjet-Printed Indium-Gallium-Zinc-Oxide Thin-Film Transistors Using Sr-Doped Al2O3 Gate Dielectric [O] . Seungbeom Choi, Kyung-Tae Kim, Sung Kyu Park, 2019

机译：使用掺Sr的Al2O3栅介质的高迁移率喷墨印刷铟镓锌氧化物薄膜晶体管
7. Unraveling the Issue of Ag Migration in Printable Source/Drain Electrodes Compatible with Versatile Solution-Processed Oxide Semiconductors for Printed Thin-Film Transistor Applications [O] . -1

机译：与印刷薄膜晶体管应用的多功能溶液加工的氧化物半导体兼容的可打印源/漏电极中的AG迁移问题

Materials integration for printed zinc oxide thin-film transistors: Engineering of a fully-printed semiconductor/contact scheme

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