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Method for lower thermal budget multiple cures in semiconductor packaging

机译:降低半导体封装中热预算的多种方法的方法

摘要

A method for forming a multilayer structure comprises the steps of: depositing a first polymerizable layer on a substrate; applying microwave energy to the polymerizable layer while monitoring at least one property of the layer; and, ending the application of microwave energy when the monitored property indicates that the polymerizable layer has reached a desired degree of cure. The property monitored may be optical, e.g., Raman spectrum, or electrical, e.g., dielectric loss. This process control strategy lowers the overall thermal budget, and is especially suitable for curing polymer films on silicon. The method may be used repetitively to cure multiple layers of polymeric material when a thicker film is needed.
机译:一种形成多层结构的方法,包括以下步骤:在基底上沉积第一可聚合层;向可聚合层施加微波能量,同时监测该层的至少一种性质;当监测到的性能表明可聚合层已达到所需的固化度时,结束微波能量的施加。监测的性质可以是光学的,例如拉曼光谱,或电气的,例如介电损耗。此过程控制策略可降低总体热预算,尤其适合于固化硅上的聚合物膜。当需要较厚的膜时,该方法可以重复地用于固化多层聚合物材料。

著录项

  • 公开/公告号US9508616B2

    专利类型

  • 公开/公告日2016-11-29

    原文格式PDF

  • 申请/专利权人 IFTIKHAR AHMAD;ROBERT L. HUBBARD;

    申请/专利号US201213506722

  • 发明设计人 IFTIKHAR AHMAD;ROBERT L. HUBBARD;

    申请日2012-05-11

  • 分类号H01L21/66;H01L23/29;H01L21/56;H01L21/683;B32B41/00;H01L23/00;B32B38/00;

  • 国家 US

  • 入库时间 2022-08-21 13:41:13

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