Method for creating a line splitting in a substrate of multiple layers and multiple layered printed circuit comprising at least one line splitting built according to said method, and used as a slot insulation or antenna

摘要

Summary "method to create a line splitting in a substrate of multiple layers and multiple layered printed circuit comprising at least one line splitting built according to said method, and used as a slot insulation or antenna", the present invention relates to u. M method to construct a line splitting short circuitada in a substrate of multiple layers including PELess of a first layer conductive, a dielectric layer and a second conductive layer, the method comprising the following steps: - record in the first layer conductive line splitting (2) having an electrical length L, save in the first conductive layer around the line splitting. A first part (5a) of a first band having an electrical length L1 = L,- save in the first conductive layer around the line split, a second part (5b) of said first band, having an electrical length L2 = L, - record in the second conductive layer, a second band (7) in the form of a loop having an electrical length L3.One end (8a) of the second band being connected to the first part of the first band and the other end (8B) of the second band being connected to the second part of the first band to form a conductive loop. The method is used notably to build lines insulation slits and antenna apertures.