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process of applying a thermofluid adhesive to a substrate and apparatus for applying a thermofluid adhesive to a series of substrates

机译:将热流体粘合剂施加到基底上的方法和将热流体粘合剂施加到一系列基底上的设备

摘要

process of applying a thermofluid adhesive to a substrate and apparatus for applying a thermofluid adhesive to a series of substrates an extrusion process and apparatus for depositing precise, usually small amounts of extrudate (4) for adhesion to a substrate (1) comprising an extruder (2) positioned next to the substrate (1) and a hot gas jet (6) directed at the extruder (4) between the extruder (2) and the substrate (1) in order to retain the properties adhesion between the extrudate (4) and the substrate (1).
机译:将热流体粘合剂施加到基材上的方法和将热流体粘合剂施加到一系列基材上的设备,挤出工艺和设备,用于沉积精确的通常少量的挤出物(4)以粘附到包含挤出机的基材(1)上( 2)紧靠基材(1)放置,并在挤出机(2)和基材(1)之间将热气体喷口(6)对准挤出机(4),以保持挤出物(4)之间的性能粘合以及基板(1)。

著录项

  • 公开/公告号BR112015015937A2

    专利类型

  • 公开/公告日2017-07-11

    原文格式PDF

  • 申请/专利权人 ZEPHYROS INC.;

    申请/专利号BR20151115937

  • 申请日2014-01-10

  • 分类号B05C5;B29C47/02;B29C47/88;B29C48/92;B29C67;

  • 国家 BR

  • 入库时间 2022-08-21 13:40:09

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