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aluminum alloy based material with single bond thermal bonding function, method for its manufacture and aluminum alloyed body using aluminum alloy based material

机译:具有单键热粘合功能的铝合金基材料,其制造方法和使用铝合金基材料的铝合金体

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Summary "aluminum alloy based material with single bond thermal bonding function, method for its manufacture and aluminum alloyed body using aluminum alloy based material" The invention provides an aluminum alloy based material aluminum capable of being thermally bonded in a single layer without the use of a bonding agent, such as a filler metal for brazing or welding. This invention also provides a bonding method for the aluminum alloy material and an aluminum alloy body using the aluminum alloy material. The aluminum alloy based material is made of an aluminum alloy containing itself: 1.0 to 5.0 wt% and fe: 0.01 to 2.0 wt% with equilibrium al and unavoidable impurities. The aluminum alloy based material contains 10 to 1 x 104 parts / µm3 of al-based intermetallic compounds with equivalent circular diameters of 0.01 to 0.5 µm and 200 parts / mm2 or less of aluminum-based intermetallic compounds. si with equivalent circular diameters of 5.0 to 10 µm.
机译:发明内容“具有单键热粘合功能的铝合金基材料,其制造方法以及使用铝合金基材料的铝合金体”本发明提供了一种铝合金基材料,其能够在不使用金属的情况下以单层热粘合。粘合剂,例如用于钎焊或焊接的填充金属。本发明还提供了用于铝合金材料和使用铝合金材料的铝合金体的结合方法。铝合金基材料由含有自身:1.0至5.0wt%和fe:0.01至2.0wt%且具有平衡的al和不可避免的杂质的铝合金制成。铝合金基材料包含10至1×104份/μm3的当量圆直径为0.01至0.5μm的铝基金属间化合物和200份/ mm 2以下的铝基金属间化合物。 si的等效圆直径为5.0到10 µm。

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