首页> 外国专利> HOT PRESS FORMED PARTS HAVING EXCELLENT POWDERING RESISTANCE DURING HOT PRESS FORMING AND METHOD FOR MANUFACTURING SAME

HOT PRESS FORMED PARTS HAVING EXCELLENT POWDERING RESISTANCE DURING HOT PRESS FORMING AND METHOD FOR MANUFACTURING SAME

机译:在热压成型过程中具有出色抗粉化性的热压成型零件及其制造方法

摘要

Provided are: hot press formed (HPF) member having excellent powdering resistance during hot press forming; and a method for manufacturing same. The present invention relates to an HPF member having excellent powdering resistance during hot press forming the HPF member having a hot dip coating layer containing Al on a surface of a base steel sheet wherein the base steel sheet includes based on wt% 0.18 0.25% of C 0.1 1.0% of Si 0.9 1.5% of Mn 0.03% or less of P 0.01% or less of S 0.01 0.05% of Al 0.05 0.5% of Cr 0.01 0.05% of Ti 0.001 0.005% of B 0.009% or less of N the balance Fe and the other impurities; the hot dip coating layer comprises a soft diffusion layer and a hard alloy layer; the alloy layer has a Tau phase in the range of 10 30% in terms of area percent; and the Tau phase contains 10% or more of Si and 0.2% or more of Cr on the basis of wt% of the Tau phase itself such that the alloy layer has a thickness of 35 or less.
机译:提供:在热压成型期间具有优异的耐粉化性的热压成型(HPF)构件;及其制造方法。本发明涉及一种在热压成型中具有优异的耐粉化性的HPF构件,该HPF构件在基体钢板的表面上具有包含Al的热浸涂层的热熔覆层,其中,基体钢板包含0.18重量%至0.25重量%的C。硅的0.1 1.0%的0.9 0.9锰的1.5%的P的0.03%以下的S的0.01%的0.01%铝的0.05%Cr的0.01%的0.01%Ti的0.05%0.001的B的0.005%的N的0.005%铁和其他杂质;热浸涂层包括软扩散层和硬合金层。合金层的Tau相以面积百分比计为10〜30%。并且,以Tau相自身的重量%为基准,Tau相含有10%以上的Si和0.2%以上的Cr,从而合金层的厚度为35以下。

著录项

  • 公开/公告号IN201717006020A

    专利类型

  • 公开/公告日2017-06-09

    原文格式PDF

  • 申请/专利权人

    申请/专利号IN201717006020

  • 发明设计人 SOHN IL RYOUNG;BAE DAE CHUL;KIM HEUNG YUN;

    申请日2017-02-20

  • 分类号C22C38/38;C22C38/28;C23C2/12;

  • 国家 IN

  • 入库时间 2022-08-21 13:38:25

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