首页> 外国专利> FILM THICKNESS CONTROL SYSTEM, FILM THICKNESS CONTROL METHOD, VAPOR DEPOSITION DEVICE AND VAPOR DEPOSITION METHOD

FILM THICKNESS CONTROL SYSTEM, FILM THICKNESS CONTROL METHOD, VAPOR DEPOSITION DEVICE AND VAPOR DEPOSITION METHOD

机译:膜厚控制系统,膜厚控制方法,蒸镀装置及蒸镀方法

摘要

A vapor deposition device (100) film thickness control system, comprising: a moving device (01), a film thickness measuring apparatus (3) and computer, wherein, the film thickness measuring apparatus (3) is installed on the moving device (01), and is connected to the computer, and is for acquiring, from the computer, coordinates of a position to be measured of a substrate (4) to be measured and sending to the computer the measured actual film thickness of the position to be measured. The computer is for calculating a new compensation value on the basis of the actual film thickness, a preset film thickness and a current compensating value when the actual film thickness does not exceed a preset film thickness error range, and sending the new compensating value to the vapor deposition device (100) as a compensating vapor deposition reference. Further provided is a film thickness control method, vapor deposition device (100) and vapor deposition method.
机译:一种汽相沉积装置(100)的膜厚控制系统,包括:移动装置(01),膜厚测量装置(3)和计算机,其中,膜厚测量装置(3)安装在移动装置(01)上),并且连接到计算机,并且用于从计算机获取要测量的基板(4)的要测量位置的坐标,并将测量到的要测量位置的实际膜厚发送到计算机。该计算机用于当实际膜厚不超过预定膜厚误差范围时,基于实际膜厚,预设膜厚和电流补偿值来计算新的补偿值,并将该新补偿值发送至显示器。气相沉积装置(100)作为补偿气相沉积参考。还提供了一种膜厚度控制方法,气相沉积装置(100)和气相沉积方法。

著录项

  • 公开/公告号WO2017049841A1

    专利类型

  • 公开/公告日2017-03-30

    原文格式PDF

  • 申请/专利权人 BOE TECHNOLOGY GROUP CO. LTD.;

    申请/专利号WO2016CN73623

  • 发明设计人 FU WENYUE;CHEN LIQIANG;SUN JUNMIN;

    申请日2016-02-05

  • 分类号C23C14/54;C23C14/24;

  • 国家 WO

  • 入库时间 2022-08-21 13:31:37

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