Bonding polycrystalline diamond compacts to hard composite substrates to produce polycrystalline diamond compact (PDC) cutters may be achieved with a partial transient liquid-phase (PTLP) bonding method that uses lower temperatures than comparable brazing methods. For example, an interlayer bonding structure may be positioned between a polycrystalline diamond compact and a hard composite substrate and heated to a bonding temperature to achieve the PTLP bonding between the polycrystalline diamond compact and the hard composite substrate. An exemplary interlayer bonding structure includes a refractory layer between two outer layers.
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