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PACKAGING METHOD FOR HIGH GAMUT WHITE LIGHT QUANTUM DOT LED

机译:高弹白光量子点LED的包装方法

摘要

Disclosed in the present invention is a packaging method for high gamut white light quantum dot LED, which comprises the following steps: a, adding an organic solvent to a red light quantum dot fluorescent powder and a blue light quantum dot fluorescent powder, respectively; b, carrying out ultrasonic processing on the solution; c, preparing a mixed quantum dot solution; d, adding a mixed packaging glue to the mixed quantum dot solution and stirring well; e, removing the organic solvent; f, adding a green light rare earth fluorescent powder; and g, dropping the mixed fluorescent glue to an LED support fixed with an ultraviolet chip, baking and curing to obtain an LED light bead. The packaging method of the present invention can prepare high gamut white light LED, which greatly increases the gamut value of the LED back-light bead to NTSC 92% or higher. The organic solvent serves as a connection bridge, so that quantum dots and the packaging glue are uniformly mixed, thus preventing the agglomeration failure phenomenon of the quantum dot fluorescent powder, as well as significantly improving the quality of the high gamut white light LED bead.
机译:本发明公开了一种高色域白光量子点LED的封装方法,包括以下步骤:a,分别向红光量子点荧光粉和蓝光量子点荧光粉中添加有机溶剂。 b,对该溶液进行超声处理; c,制备混合量子点溶液; d,在混合量子点溶液中加入混合包装胶并充分搅拌; e,去除有机溶剂; f,加入绿光稀土荧光粉; g,将混合的荧光胶滴入固定有紫外线芯片的LED支架上,烘烤固化,得到LED灯珠。本发明的封装方法可以制备高色域的白光LED,从而将LED背光珠的色域值大大提高到NTSC的92%或更高。有机溶剂充当连接桥,使得量子点和包装胶均匀混合,从而防止了量子点荧光粉的团聚破坏现象,并显着提高了高色域白光LED珠的质量。

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