COPPER POWDER AND ELECTRICALLY CONDUCTIVE PASTE ELECTRICALLY CONDUCTIVE COATING ELECTRICALLY CONDUCTIVE SHEET AND ANTISTATIC COATING USING SAME

摘要

The present invention provides a copper powder which exhibits a high conductivity suitable as a metal filler applied to a conductive paste, a resin for electromagnetic shielding, and an antistatic paint or the like, has excellent uniform dispersibility required for paste formation, and suppresses an increase in viscosity due to agglomeration. The copper powder (1) according to the present invention is a copper powder (2), which constitutes a resinous form having a plurality of branches, and the copper particles (2) have a diameter of 0.2 to 0.5 탆, And the average particle size (D50) of the active ingredient 1 in which the elliptic copper particles 2 are aggregated is 5.0 탆 to 20 탆, the length being in the range of 0.5 탆 to 2.0 탆. By mixing the dendritic copper component (1) with the resin, for example, a conductive paste exhibiting excellent conductivity can be produced.