Non-aqueous dispersion of fluorinated resin heat cure resin composition containing fluorinated resin and the cured product thereof adhesive composition for circuit board

摘要

The present invention relates to a non-aqueous dispersion of a fluorinated resin which has a minute particle size, low viscosity, and storage stability; to a thermosetting resin composition containing the fluorinated resin and the non-aqueous dispersion of the fluorinated resin, and a cured product thereof; and to an adhesive composition for a circuit board. The non-aqueous dispersion of the fluorinated resin at least contains: micropowder of the fluorinated resin; a compound represented by formula I, wherein l, m, and n in the formula I are integers bigger than 0; and a non-aqueous solvent.