HEAT TREATMENT METHOD FOR PREVENTING DIFFUSION OF COPPER BETWEEN GOLD ALLOY AND COPPER MATERIAL, AND HOLLOW CHAIN PRODUCT USING SAME

摘要

The present invention relates to a heat treatment method for preventing diffusion of copper atoms between a gold alloy and a copper material and, more specifically, to a heat treatment method, which heat-treats a first material consisting coppers and a second material connected to the first material and containing any material other than copper. A diffusion preventing layer for preventing diffusion of copper from the first material to the second material is formed on a surface of the first material connected to the second material.;COPYRIGHT KIPO 2017