INSULATION BOARD INTEGRATED WITH FLOORING MATERIAL USING KENAF FIBER

摘要

The present invention provides an insulation board integrated with a flooring material using kenaf fiber which has excellent machinability, heat conductivity, shock absorption property, and heat insulation property by having a minute porous structure. To achieve this purpose of the present invention, the insulation board integrated with the flooring material using the kenaf fiber comprises: a panel in which 40-50 wt% of PP fiber and 50-60 wt% of the kenaf fiber are mixed, heated, and compressed to have a minute void; a flooring material attached to an upper surface of the panel; a wiring groove cut at a predetermined depth to wire an electrothermal wire in a zigzag on a bottom of the panel attached to the flooring material; an insulation tape to prevent the electrothermal wire from being separated by being attached along the wiring groove; and a finishing sheet attached to an entire bottom of the panel to which the insulation tape is attached. Moreover, the panel has a thickness of 6-8 mm and a weight of 1,400-1,800 g/m^2. Also, the wiring groove is reversely tapered to an inner side and further includes a rubber ball to fixate the electrothermal wire by being inserted into the wiring groove. According to the present invention, the panel having the environmentally friendly and minute porous structure as the PP fiber (or PET fiber) and the kenaf fiber are mixed is applied to the insulation board; thereby the insulation board is able to obtain not only an effect of reducing interlayer noise, but also excellent heat insulation property and heat conductivity. Also, a proper physical property is applied to the panel to wire the electrothermal wire, thus the insulation board having excellent machinability to cut the wiring groove on the bottom of the panel or to cut the panel. Furthermore, the electrothermal wire in the wiring groove is able to easily be fixated by the rubber ball; thereby the insulation board being able to reduce a time consumed for wiring work, and having excellent constructability as the flooring material is integrally formed.;COPYRIGHT KIPO 2017