A clamping state detection system and method for detecting a clamping state of a clamping device is provided. A clamping device having a clamping surface is configured to selectively clamp a workpiece to a clamping surface. The clamping device may optionally be an electrostatic chuck or a mechanical clamp for gripping a semiconductor wafer. A vibration induction mechanism is further provided, wherein the vibration induction mechanism is configured to selectively oscillate the workpiece with one or more clamping devices. A vibration sensing mechanism is also provided, wherein the vibration sensing mechanism is configured to detect vibrations of the workpiece and one or more clamping devices. The detection of the clamping state determines the state of the workpiece by using acoustic characteristic changes such as inherent resonance frequency or transition of acoustic impedance. The controller is further configured to determine a clamping condition associated with clamping of the workpiece against the clamping surface. The clamping condition is related to the detected vibration of one or more clamping devices and the workpiece.
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