A method of providing chippings (22) on a substrate includes providing a substrate (10); Coating an adhesive (12) on a layer over the substrate; Placing a plurality of first chippets (20) on the adhesive layer (12) at separate chippet location (s) (22) to attach the first chippings to the adhesive layer The first chitlet (s) are attached to the adhesive layer at the attached chippet location (s) and the first chitlet (s) are not attached at the unattached chippet location (s) 24); Locally treating the adhesive layer at the unattached chiplet location (s) to control the adhesive layer at locations that are not adhered to receive the second chitets; Positioning the second chippet (s) on the adhesive layer at a controlled, unattached chippet location (s) to attach the second chippets to the adhesive layer at unattached locations; And curing the adhesive in order.
展开▼
