METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT BUMP-FORMED PLATE-LIKE MEMBER RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin sealed electronic component capable of manufacturing a resin sealed electronic component, having both a via electrode (bump electrode) and a planar member, conveniently and efficiently.;SOLUTION: A resin sealed electronic component includes a substrate 21, an electronic component 31, a resin 41, a planar member 11 and a bump electrode 12, and a wiring pattern 22 is formed on the substrate 21. A method of manufacturing a resin sealed electronic component has a resin sealing step for sealing the electronic component 31 with resin 41. Between a bump electrode 12 fixing surface in a planar member with a bump electrode, where the bump electrode 12 is fixed to one surface of the planar member 11, and the wiring pattern 22 formation surface of the substrate 21, the electronic component 31 is sealed with the resin 41, and the bump electrode 12 is brought into contact with the wiring pattern 22.;COPYRIGHT: (C)2016,JPO&INPIT