Composition for preparing thermosetting resin cured product of the composition prepreg and prepreg laminate having the cured product and metal clad laminate and printed circuit board having the prepreg or the prepreg laminate

摘要

A composition for the production of a thermosetting resin and a cured product thereof, a prepreg and a prepreg laminate comprising the cured product, and a metal-clad laminate and printed wiring board employing the prepreg or prepreg laminate. The disclosed composition for preparing a thermosetting resin includes an aromatic polyester amide copolymer having an amino end group and pyromellitic dianhydride.