PHOTOSENSITIVE RESIN COMPOSITION RELIEF PATTERN FILM THEREOF METHOD FOR PRODUCING RELIEF PATTERN FILM ELECTRONIC COMPONENT OR OPTICAL PRODUCT INCLUDING RELIEF PATTERN FILM AND ADHESIVE INCLUDING PHOTOSENSITIVE RESIN COMPOSITION

摘要

An object of the present invention does not have the problems of the prior art, in a low-temperature process, it will easily obtain precision of the photosensitive resin composition capable of forming a high polyimide pattern. (A) a polyamic acid or poly polymeric precursor has a repeating unit of the polyamic acid ester and, (B) an active non-ionic photoreactive latent basic substance for generating a strongly basic tertiary amine upon irradiation with light to at least a portion the photosensitive resin composition as described is obtained in that it contains a.;