TAPE FOR CHIP SUPPORT METHOD FOR SUPPORTING CHIP SHAPE WORK METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR CHIP SUPPORT AND METHOD FOR MANUFACTURING TAPE FOR CHIP SUPPORT

摘要

And to provide a chip holding tape for facilitating the peeling of the chip-shaped workpiece. The pressure-sensitive adhesive layer has a chip-shaped workpiece attaching region for attaching a chip-shaped workpiece and a frame attaching region for attaching the mount frame. The mount frame is attached to the frame attaching region and used Wherein the 180 degree peel adhesive force of the adhesive layer on the silicon mirror wafer in the frame attaching region is at a temperature of 23 +/- 3 DEG C and a tensile rate of 300 mm / Of a 180-degree peel adhesive force to a silicon mirror wafer of 5 times or more.