RF APPARATUS AND METHODS RELATED TO WIRE BOND PADS AND REDUCING IMPACT OF HIGH RF LOSS PLATING

摘要

For example, to reduce radio frequency (RF) losses associated with high RF loss plating such as nickel / palladium / gold (Ni / Pd / Au) plating, in some embodiments, edge and sidewalls of the wire- The solder mask can be reconfigured to prevent the solder mask from being damaged. Placing the edges and sidewalls of the wire bond region without high RF loss plating, such as Ni / Pd / Au plating, provides a path through which the RF current flows through the high resistance material, . Also, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) may be used to reduce RF losses associated with high RF loss plating, such as Ni / Pd / And may be located in the RF top signal path relative to the RF signal output of the RFIC. By placing the on-die passive device in the RF top signal path, the RF current does not directly pass through the high RF lossy material of the passive device bonding pad.