首页> 外国专利> LOW-COST, UNCONNECTED, HIGHER STRENGTH AND SMALL FORM FACTOR OPTICAL SUB-UNIT (OSA) AND ONE-CONTAINER BUS (DIB)

LOW-COST, UNCONNECTED, HIGHER STRENGTH AND SMALL FORM FACTOR OPTICAL SUB-UNIT (OSA) AND ONE-CONTAINER BUS (DIB)

机译:低成本,无连接,强度更高,外形更小的光学子单元(OSA)和单容器总线(DIB)

摘要

Systems, methods, and apparatus for an optical sub-assembly (OSA) are disclosed. In one or more embodiments, the disclosed apparatus involves a package body, and a lock nut, where a first end of the lock nut inserted into a first cavity of the package body. The apparatus further involves a transistor outline (TO) can, where a first end of the TO can is inserted into a second cavity of the package body. Also, the apparatus involves an optical fiber, where a portion of the jacket from an end of the optical fiber is stripped off, thereby exposing bare optical fiber at the end of the optical fiber. The end of the optical fiber is inserted into a second end of the lock nut such that the bare optical fiber passes into the package body and at least a portion of the bare optical fiber is inserted into the TO can cavity.
机译:公开了用于光学子组件(OSA)的系统,方法和设备。在一个或多个实施例中,所公开的设备包括包装体和锁紧螺母,其中,锁紧螺母的第一端插入包装体的第一腔中。该设备还包括晶体管轮廓(TO)罐,其中TO罐的第一端插入封装主体的第二腔中。而且,该设备涉及光纤,在该光纤中,剥去了从光纤的一端到护套的一部分,从而在光纤的一端暴露了裸露的光纤。光纤的端部插入锁紧螺母的第二端,以使裸露的光纤进入包装主体,并且裸露的光纤的至少一部分插入到TO罐腔中。

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