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METHOD OF ASSEMBLING AN ELECTRONIC MODULE, WHICH PROVIDES IMPROVED THERMAL AND OVERALL DIMENSIONS
METHOD OF ASSEMBLING AN ELECTRONIC MODULE, WHICH PROVIDES IMPROVED THERMAL AND OVERALL DIMENSIONS
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机译:组装电子模块的方法,该模块提供改进的热尺寸和整体尺寸
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摘要
FIELD: cooling.;SUBSTANCE: invention can be used for cooling a group of heat-generating elements arranged on a printed wiring board. On each side of the base printed wiring board between heat-generating elements of a group of submodules, arranged on both sides of base printed wiring board, and the base printed wiring board there is a heat-conducting plate connected to a radiator to form electrically closed volume. Housing cover of the heat-generating elements of submodules face to heat-conducting plates, and heat-conducting gaskets are placed between the printed wiring boards of submodules and inner surface of the radiators, wherein the radiators are connected to the base printed wiring board.;EFFECT: providing efficient heat removal and minimizing design dimensions, there is no need to use forced air circulation inside the device, providing electromagnetic shielding of printed a printed wiring board with electronic components at limitations on the thickness of the device.;1 cl, 3 dwg
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