where P is the destructive load, MH; Y - the correction factor; t - the sample width, m; H - the distance from the incision to the sample face, m; l - incision depth l=b/4, here b is the sample height, m.;EFFECT: increasing the accuracy and reliability of determining the critical stress intensity factor by forming areas of stress concentrations in the form of incisions.;1 dwg, 2 tbl"/>
公开/公告号RU2621618C1
专利类型
公开/公告日2017-06-06
原文格式PDF
申请/专利号RU20160123982
申请日2016-06-17
分类号G01N3/24;
国家 RU
入库时间 2022-08-21 13:23:32