An experimental technique to determine critical stress intensity factors for delamination initiation

摘要

Interfacial delamination is an important reliability concern in multilayered microelectronic packages. Local asymptotic solutions, based on linear elastic assumptions, are available for estimating the free-edge stress intensity factory (SIF). However, to be able to predict delamination initiation, it is necessary to determine the critical free-edge SIF. In this paper, an experimental method has been proposed and conducted to determine the critical free-edge SIF. The test is based on the simple and standard shear strength test, which is well specified by ASTM standard for surface mount components, as opposed to specially designed or complicated test apparatus and fixture. The critical free-edge SIF for copper/ViaLux~(TM) 81 photo-definable dry film PDDF interface has been determined with the proposed test method and calibrated using finite element analysis.