Laser processing of a multiphase transparent material, as well as multiphase composite material

摘要

The invention provides a method for producing modifications in or on a transparent workpiece (2) by means of a laser processing device (1), using a laser processing device (1) comprising a short-pulse or ultra-short pulse laser (10), which emits laser radiation (12 ) having a wavelength in the transparency region of the workpiece (2), and a beam shaping optical system (11) for beam shaping, in particular for focusing the laser radiation, and wherein a transparent workpiece (2) is used, which consists of a material having a plurality of phases of which at least two phases have different dielectric constants, of which in turn the one phase is a particle-entrapped phase substantially surrounded by the other phase, and wherein the product is the volume of particles indicated in cubic nanometers and the ratio the amount of the difference of the two different di electricity numbers to the relative permittivity of the surrounding phase greater than 500, preferably greater than 1000, more preferably greater than 2000, so that the modifications in or on the transparent workpiece (2) reach a greater extent than on a workpiece made of the same material, which has no phase enclosed in the form of particles.