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A method and apparatus for selecting a paste stencil for paste printing and for applying paste to a substrate using the selected paste stencil

机译:一种用于选择用于糊料印刷的糊料模板以及使用所选择的糊料模板将糊料施加到基板上的方法和设备

摘要

The invention relates to a method and an apparatus for selecting a paste stencil (10) for a paste printing on a substrate (20), wherein the paste stencil (10) is selected on the basis of a stencil thickness (h) in which an area ratio of a small passage opening (11a, 11b) of the substrate is equal to or larger than a target area ratio. The present invention further relates to a method and a device for applying paste material (30) to a substrate (20) for at least one small component (21a, 21b) and at least one large component (22) that is larger than the at least one small component (21a, 21b). 21b), wherein paste material (30) for the at least one small component (21a, 21b) and the at least one large component (22) is applied by means of a paste template (10) selected according to the invention, and additional paste material (30) is applied to the paste material (30). for the at least one large component (22) after paste material (30) has been applied by means of the selected paste template (10) for the at least one small component (21a, 21b) and the at least one large component (22).
机译:本发明涉及一种用于选择用于在基板(20)上进行浆料印刷的浆料模板(10)的方法和设备,其中,基于模板厚度(h)选择浆料模板(10),其中,基板的小通道开口(11a,11b)的面积比等于或大于目标面积比。本发明还涉及一种用于将糊状材料(30)施加到基板(20)上的方法和装置,用于至少一个小部件(21a,21b)和至少一个大部件(22),所述大部件大于至少一个小部件(21a,21b)。 21b),其中用于至少一种小组分(21a,21b)和至少一种大组分(22)的糊料(30)是通过根据本发明选择的糊料模板(10)施加的,并且另外将糊料(30)施加到糊料(30)上。在通过选定的糊剂模板(10)将糊料(30)应用于至少一种小成分(21a,21b)和至少一种大成分(22)之后,对至少一种大成分(22)进行处理)。

著录项

  • 公开/公告号DE102015120185A1

    专利类型

  • 公开/公告日2017-05-24

    原文格式PDF

  • 申请/专利权人 ASM ASSEMBLY SYSTEMS GMBH & CO. KG;

    申请/专利号DE201510120185

  • 发明设计人 WERNER LIEGEL;

    申请日2015-11-20

  • 分类号H05K3/34;H05K13/04;

  • 国家 DE

  • 入库时间 2022-08-21 13:22:48

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