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Inspection device and method for verifying a chip card semi-finished product

机译:芯片卡半成品的检验装置及检验方法

摘要

The invention relates to an inspection device (100) for verifying a semifinished product (101) for producing a chip card having a cutout bounded by a laser cutting edge (103a) for receiving an electronic circuit (104) comprising: an illumination source (105) which is formed Illuminate semifinished product (101) with light of a predetermined wavelength; an image camera (107), which is designed to capture an image recording of the illuminated semi-finished product (101) with the cut-out delimited by the laser cutting edge (103a); and a processor (109), which is designed to detect in the acquired image recording a circumferential region having a light intensity which is greater than a light intensity of an area outside the circumferential region in the acquired image recording in order to control the course of the laser cutting edge (103a). to determine and to verify the semifinished product (101) on the basis of the course of the laser cutting edge (103a).
机译:本发明涉及一种检验装置(100),用于检验用于生产芯片卡的半成品(101),该芯片卡具有由激光切割边缘(103a)界定的用于容纳电子电路(104)的切口,包括:光源(105)用预定波长的光照亮半成品(101);图像照相机(107),其被设计为捕获具有被激光切割边缘(103a)界定的切口的照明的半成品(101)的图像记录;处理器(109),其被设计为在所获取的图像记录中检测周向区域,该周向区域的光强度大于所获取的图像记录中在周向区域之外的区域的光强度,以控制图像处理的过程。激光切割边缘(103a)。以确定和验证半成品(101)的基础上,激光切割边缘(103a)的路线。

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