A method for joining at least two components of an endoscope, component of an endoscope and endoscope

摘要

In a method according to the invention for connecting at least two components 7, 2, of an endoscope, at least one solder mold part 18, which contains a high-temperature solder, is brought into at least one solder reservoir of at least one of the components, the at least two components are held to one another such that, between joining regions, which are assigned to one another, of the at least two components, there is formed at least one soldering gap which is in capillary connection with the at least one solder reservoir 15, 16, 17, and the arrangement (1, 22) made up of the at least two components and the at least one solder mold part 18 is heated to a soldering temperature of the high-temperature solder. The invention also relates to a component of an endoscope and to an endoscope.