首页> 外国专利> PROCESSING METHOD OF SPUTTERING TARGET, PROCESSING DEVICE OF SPUTTERING TARGET, SPUTTERING TARGET, AND PRODUCTION METHOD OF SPUTTERING TARGET PRODUCT

PROCESSING METHOD OF SPUTTERING TARGET, PROCESSING DEVICE OF SPUTTERING TARGET, SPUTTERING TARGET, AND PRODUCTION METHOD OF SPUTTERING TARGET PRODUCT

机译:溅射靶材的加工方法,溅射靶材的加工设备,溅射靶材以及溅射靶材的生产方法

摘要

PROBLEM TO BE SOLVED: To provide a processing method of a sputtering target capable of achieving a sputtering target having little strain.SOLUTION: A processing method of a sputtering target has steps of: installing a sputtering surface or an opposite surface of the sputtering target on an anchor block, to thereby fix the sputtering target on the anchor block; and scraping the outer peripheral surface of the sputtering target by a scraping tool, while rotating the scraping tool in the circumferential direction on the outer peripheral surface of the sputtering target.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种能够实现应变小的溅射靶的溅射靶的处理方法。解决方案:溅射靶的加工方法具有以下步骤:在其上设置溅射面或溅射面的相反面。锚块,从而将溅射靶固定在锚块上;然后,在沿着溅射靶的外周表面沿圆周方向旋转刮具的同时,用刮具刮削溅射靶的外周表面。图1

著录项

  • 公开/公告号JP2018131687A

    专利类型

  • 公开/公告日2018-08-23

    原文格式PDF

  • 申请/专利权人 SUMITOMO CHEMICAL CO LTD;

    申请/专利号JP20180016407

  • 发明设计人 FUJITA MASAHIRO;NISHIOKA KOJI;

    申请日2018-02-01

  • 分类号C23C14/34;B23C1/06;B23C3;

  • 国家 JP

  • 入库时间 2022-08-21 13:13:29

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