THROUGH-ELECTRODE SHEET-LIKE BODY, MOUNTING BOARD WITH THROUGH ELECTRODE SUBSTRATE, AND METHOD FOR MANUFACTURING THROUGH-ELECTRODE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a through-electrode substrate which never damages a base when removing an unwanted dielectric layer by an etching method, such as reactive ion etching in a manufacturing process of a thin film capacitor.;SOLUTION: A through-electrode substrate 10 comprises: a substrate 12 with a through-hole 20 provided therein; a through-electrode 22 located in the through-hole of the substrate; and a capacitor 15 located on a first face of the substrate. The capacitor has: a first face first conductive layer 31 electrically connected to the through-electrode; a first face first inorganic layer 32 located on the first face first conductive layer on the first face of the substrate, including an inorganic material, and having an insulating property; and a first face second conductive layer 33 located on the first face first inorganic layer. The through-electrode substrate also comprises a first face first organic layer 34 located on the first face first inorganic layer and on the first face second conductive layer, having an end, which coincides in position with an end of the first face first inorganic layer on the first face first conductive layer in an in-plane direction of the substrate, and including an organic material.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT