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STRUCTURE WITH METALLIC MATERIAL FOR HEAT DISSIPATION, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT, AND METALLIC MATERIAL FOR HEAT DISSIPATION
STRUCTURE WITH METALLIC MATERIAL FOR HEAT DISSIPATION, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT, AND METALLIC MATERIAL FOR HEAT DISSIPATION
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机译:用于散热的金属材料结构,印刷电路板,电子设备以及用于散热的金属材料
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摘要
PROBLEM TO BE SOLVED: To provide a structure with a metal material for heat dissipation which can dissipate heat from a heating element satisfactorily.SOLUTION: The structure with a metallic material for heat dissipation includes: a heating element protecting member provided so as to cover a part or the whole of a heating element and spaced apart from the heating element; and a heat dissipating member provided on the surface of the heating element protecting member on the side of the heating element so as to be spaced apart from the surface of the heat generating member on the heat generating member protecting member side. The heat dissipating member is provided with at least a heat dissipating metal material on the heating element side surface.SELECTED DRAWING: Figure 2
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