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STRUCTURE WITH METALLIC MATERIAL FOR HEAT DISSIPATION, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT, AND METALLIC MATERIAL FOR HEAT DISSIPATION

机译:用于散热的金属材料结构,印刷电路板,电子设备以及用于散热的金属材料

摘要

PROBLEM TO BE SOLVED: To provide a structure with a metal material for heat dissipation which can dissipate heat from a heating element satisfactorily.SOLUTION: The structure with a metallic material for heat dissipation includes: a heating element protecting member provided so as to cover a part or the whole of a heating element and spaced apart from the heating element; and a heat dissipating member provided on the surface of the heating element protecting member on the side of the heating element so as to be spaced apart from the surface of the heat generating member on the heat generating member protecting member side. The heat dissipating member is provided with at least a heat dissipating metal material on the heating element side surface.SELECTED DRAWING: Figure 2
机译:解决的问题:提供一种用于散热的金属材料的结构,该结构可以令人满意地消散来自加热元件的热​​量。解决方案:具有用于散热的金属材料的结构包括:加热元件保护部件,其设置为覆盖加热元件的一部分或全部,并与加热元件间隔开;散热构件设置在发热体保护构件的发热体侧的表面上,并与发热体保护构件侧的发热体的表面隔开。散热部件在加热元件侧面上至少装有一种散热金属材料。图2

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