首页> 外国专利> HEAT-RESISTANT SILANE-CROSSLINKABLE RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME, HEAT-RESISTANT SILANE-CROSSLINKED RESIN MOLDED BODY AND METHOD FOR PRODUCING THE SAME, AND HEAT-RESISTANT PRODUCT USING THE HEAT-RESISTANT SILANE-CROSSLINKED RESIN MOLDED BODY

HEAT-RESISTANT SILANE-CROSSLINKABLE RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME, HEAT-RESISTANT SILANE-CROSSLINKED RESIN MOLDED BODY AND METHOD FOR PRODUCING THE SAME, AND HEAT-RESISTANT PRODUCT USING THE HEAT-RESISTANT SILANE-CROSSLINKED RESIN MOLDED BODY

机译:耐热硅烷交联树脂组合物及其制备方法,耐热硅烷交联树脂模制体及其制备方法和使用耐热硅烷交联树脂模制产品

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant silane-crosslinked resin molded body excellent in mechanical characteristics, abrasion resistance, reinforcement property, flame resistance and appearance, and to provide a method for producing the same.SOLUTION: The method for producing a heat-resistant silane-crosslinked resin molded body includes: a step (a) of melt-mixing 100 pts.mass of a resin composition (RC) containing a resin component (R) with 0.01-0.6 pts.mass of an organic peroxide (P), 10-400 pts.mass of an inorganic filler (F) containing a surface treated inorganic filler (F) obtained by surface treating a surface untreated inorganic filler (F) with a hydrolyzable silane coupling agent (S1) of 0.05-1.0 mass% of the surface untreated inorganic filler (F), and 0.5-15.0 pts.mass of an unsaturated group-containing silane coupling agent (S2) with respect to 100 pts.mass of the surface treated inorganic filler (F) at a decomposition temperature of the organic peroxide (P) or higher to prepare a silane master batch; a step (b) of obtaining a mixture from the silane master batch and a silanol condensation catalyst; and a step (c) of molding the mixture.SELECTED DRAWING: None
机译:解决的问题:提供机械特性,耐磨耗性,增强性能,阻燃性和外观优异的耐热性硅烷交联树脂成型体,并提供其制备方法。耐热性硅烷交联树脂成型体包括:步骤(a)将100磅质量的含有树脂成分(R)的树脂组合物(RC)与0.01-0.6磅质量的有机过氧化物熔融混合(a)。 P),质量为10-400 pts的无机填料(F),其中包含经过表面处理的无机填料(F),该无机填料通过用0.05-1.0的可水解硅烷偶联剂(S1)对未处理的无机填料(F)进行表面处理而获得相对于分解时的表面处理的无机填充剂(F)的100质量%,表面未处理的无机填充剂(F)的质量%,含不饱和基团的硅烷偶联剂(S2)的质量为0.5〜15.0pts。有机过氧化物(P)或高温的温度她准备硅烷母料;步骤(b),从硅烷母料和硅烷醇缩合催化剂获得混合物;以及将混合物成型的步骤(c)。

著录项

  • 公开/公告号JP2018066006A

    专利类型

  • 公开/公告日2018-04-26

    原文格式PDF

  • 申请/专利权人 FURUKAWA ELECTRIC CO LTD:THE;

    申请/专利号JP20170216794

  • 发明设计人 NISHIGUCHI MASAMI;MATSUMURA YUJI;

    申请日2017-11-09

  • 分类号C08J3/22;H01B3;H01B3/44;H01B7/02;H01B7/295;

  • 国家 JP

  • 入库时间 2022-08-21 13:12:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号