COMPOSITE METAL FOIL, COPPER-CLAD LAMINATED PLATE USING THE COMPOSITE METAL FOIL, AND METHOD FOR PRODUCING THE COPPER-CLAD LAMINATED PLATE

摘要

PROBLEM TO BE SOLVED: To provide a composite metal foil that makes it possible to produce, by a simplified method, a copper-clad laminated plate with the lamination of an extremely thin copper layer which is extremely thin and is dense and hardly suffers the formation of pinholes; that is for use in a circuit having the extremely thin copper layer as a seed layer formed by an additive method, with the seed layer being etch removable in a short period of time thereby inhibiting the circuit from undergoing the etching; and that is for use in a multilayer substrate formed from the copper-clad laminated plate, the multilayer substrate in its entirety being precluded from thickening thereby giving the multilayer substrate with a high density.SOLUTION: A composite metal foil is provided which comprises a metal foil carrier 2 and a first Ni or Ni alloy layer 3 that is stacked on at least one surface of the metal foil carrier 2, and a peeling layer 4, a second Ni layer 5 and an extremely-thin copper layer 6 that are stacked on at least one surface of the first Ni or Ni alloy layer 3, in this order, and in which the extremely-thin copper foil layer 6 has copper particles with a primary particle diameter of 10 to 200 nm and with an adhesion amount of 300 to 6000 mg/m, and the second Ni layer 5 has a thickness of 0.3 to 5 μm.SELECTED DRAWING: Figure 1