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Copper foil with carrier foil, method for producing copper foil with carrier foil, and copper clad laminate for laser drilling obtained by using the copper foil with carrier foil
Copper foil with carrier foil, method for producing copper foil with carrier foil, and copper clad laminate for laser drilling obtained by using the copper foil with carrier foil
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机译:带载体箔的铜箔,带载体箔的铜箔的制造方法以及使用带载体箔的铜箔得到的激光钻孔用覆铜层压板
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摘要
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the laser beam drilling. To achieve this purpose, a copper foil (1) with attached carrier foil is provided, said copper foil (1) with attached carrier foil having a layered structure consisting of a carrier foil (2)/a release layer (3)/a bulk copper layer (4) and being characterized in that metal component-containing grains (5) are disposed between the release layer (3) and the bulk copper layer (4). When a copper clad laminate board is manufactured by using this copper foil with attached carrier foil, a blackening treated layer with a color that ensures excellent laser beam drilling performance can be formed on the surface of the bulk copper layer.
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