首页> 外国专利> Copper foil with carrier foil, method for producing copper foil with carrier foil, and copper clad laminate for laser drilling obtained by using the copper foil with carrier foil

Copper foil with carrier foil, method for producing copper foil with carrier foil, and copper clad laminate for laser drilling obtained by using the copper foil with carrier foil

机译:带载体箔的铜箔,带载体箔的铜箔的制造方法以及使用带载体箔的铜箔得到的激光钻孔用覆铜层压板

摘要

The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad lam-inate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the laser beam drilling. To achieve this purpose, a copper foil (1) with attached carrier foil is provided, said copper foil (1) with attached carrier foil having a layered structure consisting of a carrier foil (2)/a release layer (3)/a bulk copper layer (4) and being characterized in that metal component-containing grains (5) are disposed between the release layer (3) and the bulk copper layer (4). When a copper clad laminate board is manufactured by using this copper foil with attached carrier foil, a blackening treated layer with a color that ensures excellent laser beam drilling performance can be formed on the surface of the bulk copper layer.
机译:本发明的目的是提高激光打孔覆铜箔层压板时的加工性能,所述覆铜层压板的经黑化处理的表面将用作激光打孔中的处理面。为了实现该目的,提供了具有附接的载体箔的铜箔(1),所述具有附接的载体箔的铜箔(1)具有由载体箔(2)/剥离层(3)/块状构成的层状结构。铜层(4),其特征在于,在释放层(3)和块状铜层(4)之间配置有含金属成分的晶粒(5)。当通过使用附有载体箔的铜箔制造覆铜层压板时,可以在块状铜层的表面上形成具有确保优异的激光束钻孔性能的颜色的变黑处理层。

著录项

  • 公开/公告号JP6389915B2

    专利类型

  • 公开/公告日2018-09-12

    原文格式PDF

  • 申请/专利权人 三井金属鉱業株式会社;

    申请/专利号JP20170078963

  • 发明设计人 吉川 和広;

    申请日2017-04-12

  • 分类号C25D1/04;C25D7/06;C23C28;B32B15/08;H05K1/09;H05K3;

  • 国家 JP

  • 入库时间 2022-08-21 13:11:19

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