首页> 外国专利> THERMALLY-FOAMABLE MATERIAL, SEMISOLID MATTER, METHOD FOR MOLDING SEMISOLID MATTER, AND METHOD FOR PRODUCING FOAM

THERMALLY-FOAMABLE MATERIAL, SEMISOLID MATTER, METHOD FOR MOLDING SEMISOLID MATTER, AND METHOD FOR PRODUCING FOAM

机译:热可发泡材料,半固态材料,半固态材料的模制方法以及生产泡沫的方法

摘要

PROBLEM TO BE SOLVED: To provide a thermally-foamable material which enables foams 1 and 20 excellent in physical properties such as a strength to be stably produced without requiring a labor.;SOLUTION: The thermally foamable material includes an epoxy resin, a low-temperature curing agent which starts a reaction with the epoxy resin at a first temperature in the range of 60-120°C, a foaming agent which starts thermal expansion at a second temperature in the range of 80-160°C, and a high-temperature curing agent which starts a reaction with the epoxy resin at a third temperature in the range of 120-180°C, the second temperature being higher than the first temperature, the third temperature being higher than the second temperature, and viscosity of the thermally foamable material at 23°C being 10-60 Pa s. The thermally foamable material is heated to the first temperature or higher and the second temperature or lower and is cooled, and thereby can be formed into a semisolid matter having a viscosity at 60°C of 200-800 Pa s. The semisolid matter is heated to the third temperature or higher, and thereby is formed into a foam and can be cured.;SELECTED DRAWING: Figure 6;COPYRIGHT: (C)2018,JPO&INPIT
机译:要解决的问题:提供一种可热发泡的材料,该材料可在不需要人工的情况下稳定地生产出物理性能(例如强度)优异的泡沫1和20。解决方案:该可热发泡的材料包括环氧树脂,在第一温度为60-120°C的范围内与环氧树脂开始反应的高温固化剂,在第二温度为80-160°C的范围内开始热膨胀的发泡剂和在120-180℃范围内的第三温度下与环氧树脂开始反应的温度固化剂,第二温度高于第一温度,第三温度高于第二温度,以及热粘度23℃下的可发泡材料为10-60 Pa s。将可热发泡材料加热至第一温度或更高并且第二温度或更低并且被冷却,从而可以形成为在60℃下具有200-800Pa·s的粘度的半固体。将半固体加热到第三温度或更高温度,从而形成泡沫并可以固化。;选定的图纸:图6;版权:(C)2018,JPO&INPIT

著录项

  • 公开/公告号JP2018021096A

    专利类型

  • 公开/公告日2018-02-08

    原文格式PDF

  • 申请/专利权人 SANYU REC CO LTD;

    申请/专利号JP20160151531

  • 申请日2016-08-01

  • 分类号C08J9/16;C08L69;C08L33/06;C08L51;

  • 国家 JP

  • 入库时间 2022-08-21 13:11:03

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