METHOD FOR PRODUCING SURFACE-MODIFIED SILICA PARTICLE AND METHOD FOR PRODUCING FILLER-CONTAINING COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a filler-containing composition which can be employed suitably for semiconductor device sealants or the like.SOLUTION: This invention provides surface-modified silica particles in which D90/D10 is 2 or more and D50 is 250 nm or less in volume integration from the smallest particle size, a degree of sphericity is 0.95 or more, a water absorption is 1.0% or less with reference to mass in dryness, the total amount of alkali metal and alkaline earth metal is 100 ppm or less, and a functional group comprising carbon on its surface is introduced to the surface.SELECTED DRAWING: Figure 1