ENERGIZATION TEST DEVICE AND ENERGIZATION TEST METHOD

摘要

PROBLEM TO BE SOLVED: To provide a technique allowing an electric conduction time to be shortened.SOLUTION: An energization test device comprises: a conductive first buffer material (35) that is provided over a plurality of front surface electrodes (19); a conductive second buffer material (34) that comes in contact with back surface electrodes (21 and 22) provided on a lower surface of a semiconductor wafer (31); a first conductive mechanism (33) that is provided at a position sandwiching the first buffer material between the front surface electrodes and itself; and a second conductive mechanism (32) that is provided at a position sandwiching the second buffer material between the back surface electrodes and itself. Each of the back surface electrodes of the semiconductor wafer is connected to a second end part that is an end part opposite to a first end part of a pn junction part (100), and the first and second conductive mechanisms flow current in a forward direction of the pn junction part.SELECTED DRAWING: Figure 4