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TERMINAL, SURFACE MOUNT CONNECTOR, CONNECTOR MOUNTING STRUCTURE AND TERMINAL MANUFACTURING METHOD

机译:端子,表面安装连接器,连接器的安装结构和端子制造方法

摘要

PROBLEM TO BE SOLVED: To provide a terminal in which robust soldering can be achieved even when manufactured after plating pre-processing, and also to provide a surface mount connector equipped with the same and a terminal manufacturing method.SOLUTION: There is provided a terminal 1 in which plating layers 211 and 221 are formed on an upper surface 21 and a lower surface 22 of a linear conductor 2 and a side surface 23 is formed as a fracture surface. The linear conductor 2 has a terminal part 25 extending in parallel with a substrate. A protrusion 31 soldered to the substrate covered with a plating layer 311 is formed on the lower surface of the terminal part 25.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种即使在镀覆预处理之后也能够进行牢固焊接的端子,并且提供一种具备该端子的表面安装连接器及其端子制造方法。解决方案:提供一种端子。如图1所示,其中在线性导体2的上表面21和下表面22上形成镀层211和221,并且侧面23形成为断裂表面。线状导体2具有与基板平行地延伸的端子部25。在端子部分25的下表面上形成有一个突起31,该突起焊接到覆盖有镀层311的基板上。

著录项

  • 公开/公告号JP2018032524A

    专利类型

  • 公开/公告日2018-03-01

    原文格式PDF

  • 申请/专利权人 IRISO ELECTRONICS CO LTD;

    申请/专利号JP20160164054

  • 发明设计人 SAKAMOTO TETSUMA;

    申请日2016-08-24

  • 分类号H01R13/04;H01R12/51;H01R43/16;

  • 国家 JP

  • 入库时间 2022-08-21 13:10:28

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