HEAT SINK, COOLER INCLUDING HEAT SINK, METHOD OF MANUFACTURING HEAT SINK, AND COOLING METHOD OF COOLING OBJECT

摘要

PROBLEM TO BE SOLVED: To provide a cooler capable of cooling an electronic circuit device with high calorific value, such as a CPU or a chip set, efficiently, and can be constituted lighter and more compact, and to provide a board or a computer including the same.SOLUTION: A heat sink includes a metal heat absorber 2 having an abutment surface 20 abutting on a cooling object 9, and transmitting heat of the cooling object 9, and a metal tabular fin 3 projecting from the side 21 of the heat absorber 2 adjacent to the abutment surface 20. The tabular fin 3 is projected so that the plate surface is parallel with the abutment surface 20, or tilting in a range of a prescribed angle or less, and multiple through holes 31 opening to the plate surface are formed.SELECTED DRAWING: Figure 1