首页> 外国专利> Benzoxazine compound, benzoxazine colophony produce benzoxazine colophony, hardening resin composition, solidfied material, in FRP material, semiconductor-encapsulating material, varnish, circuit board, prepreg and laminated film

Benzoxazine compound, benzoxazine colophony produce benzoxazine colophony, hardening resin composition, solidfied material, in FRP material, semiconductor-encapsulating material, varnish, circuit board, prepreg and laminated film

机译:苯并恶嗪化合物,苯并恶嗪树脂,苯并恶嗪树脂,硬化树脂组合物,固化材料,玻璃钢材料,半导体封装材料,清漆,电路板,预浸料和层压膜

摘要

PROBLEM TO BE SOLVED: To provide a benzoxazine compound and a benzoxazine resin each of which provides a cured article excellent in various properties of heat resistance, resistance to pyrolysis, fire retardancy and dielectric property, and to provided a method of producing the benzoxazine resin, a curable resin composition, the cured article thereof, an FRP material, a semiconductor encapsulation material, a varnish, a circuit board, a prepreg and a build-up film.SOLUTION: There is provided the benzooxazine compound obtained by reacting a phenol compound having a molecular structure represented by the formula (I), with a monoamine compound and formaldehyde. HO-X-OH(I) [in the formula (I), X is a structural site represented by the following formula (x1) or (x2) ].SELECTED DRAWING: None
机译:解决的问题:为了提供苯并恶嗪化合物和苯并恶嗪树脂,它们各自提供在耐热性,抗热解性,阻燃性和介电性能的各种性质方面优异的固化物,并提供生产苯并恶嗪树脂的方法,固化性树脂组合物,其固化物,FRP材料,半导体封装材料,清漆,电路板,预浸料和堆积膜。具有单胺化合物和甲醛的由式(I)表示的分子结构。 HO-X-OH(I)[在式(I)中,X是由以下式(x1)或(x2)表示的结构部位]。

著录项

  • 公开/公告号JP6413740B2

    专利类型

  • 公开/公告日2018-10-31

    原文格式PDF

  • 申请/专利权人 DIC株式会社;

    申请/专利号JP20140253998

  • 发明设计人 高橋 歩;佐藤 泰;

    申请日2014-12-16

  • 分类号C07D265/36;C08G14/073;C08L61/34;C08K3;C08J5/24;C09D161/34;H05K1/03;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-21 13:10:23

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