Benzoxazine compound, benzoxazine resin, method for producing benzoxazine compound, curable resin composition, cured product thereof, FRP material, semiconductor encapsulating material, varnish, circuit board, prepreg, and build-up film

摘要

PROBLEM TO BE SOLVED: To provide a benzoxazine compound excellent in various physical properties such as heat resistance, resistance to heat decomposition, flame retardancy and dielectric characteristics in an obtained cured product; a benzoxazine resin; a method for producing the benzoxazine compound; a curable resin composition; its cured product; an FRP material; a semiconductor sealing material; a varnish; a circuit board; a prepreg; and a build-up film.SOLUTION: A benzoxazine compound is formed by reacting a phenol compound with a monoamine compound and formaldehyde. The phenol compound has a diarylene[b,d]furan structure, at least one arylene group in the two arylene groups forming the diarylene[b,d]furan structure has a naphthylene skeleton and each of the two arylene groups has a hydroxyl group in the aromatic ring thereof.SELECTED DRAWING: None