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METHOD AND DEVICE FOR EVALUATING BOND STRENGTH OF REPAIR MATERIAL LAYER
METHOD AND DEVICE FOR EVALUATING BOND STRENGTH OF REPAIR MATERIAL LAYER
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机译:修补材料层粘结强度的评估方法和装置
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摘要
PROBLEM TO BE SOLVED: To provide a method and device for evaluating the bond strength of a repair material layer, capable of correctly evaluating the bond strength of the repair material layer even in an environment difficult to use an adhesive and evaluating bond strength in a deep portion of the repair material layer, and excellent in safety of work and maintenance of work environment.;SOLUTION: A method for evaluating bond strength between a base 1 and a repair material layer 2 formed on the surface of the base 1 comprises: a drilling step of forming an insertion hole 3 in the repair material layer 2; an insertion step of arranging a fixture 4 having a penetration part 21 on the surface 2a of the repair material layer 2 and inserting one or more extension anchors 5 into the insertion holes 3 through the penetration part 21 of the fixture 4; a fixing step of fixing the fixture 4 to the repair material layer 2 by engaging the extension anchors 5 on the inner surfaces of the insertion holes 3; and an evaluation step of adding a tensile load in a direction separated from the base 1 to the fixture 4 to separate a fragment including at least a part of the repair material layer 2 and evaluating the bond strength on the basis of the fragment.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT
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