Method for peeling resin film, method for producing electronic device having flexible substrate, method for producing organic EL display device, and device for peeling resin film

摘要

A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.